CS 3104M will protect electrical connections from corrosion by atmospheric moisture. Its low adhesive strength makes it possible to remove the encapsulating material from the connections. No special preparation is required to obtain a bond to the remaining cured material during re-encapsulation.
CS3104M is a soft, low adhesion potting compound for electrical components. CS 3104M is easily removed for access to the encapsulated components and easily repaired. CS 3104M is a two-part polysulfide based compound.